wESP32¶
What is it?¶
The wESP32™ is an ESP32-based core board with wired Ethernet connectivity and power over Ethernet (PoE) that was designed to help you quickly create zero-setup, single-wire-installation, connected devices. By combining a powerful microcontroller with excellent community support with 13 W of available power, reliable connectivity and a compact footprint, the wESP32 gives you a head start in your next IoT design and lets you focus on your application.
Features & Specifications¶
- Processor
- Espressif Systems ESP32-WROOM-32 with 4 MB of flash pre-revision 7
- Espressif Systems ESP32-WROOM-32E with 16 MB of flash revision 7 and up
- Power
- Default 12 V output setting for V+ provides 12.95+ W of power
- Optional (bridge solder jumper) 5 V output setting for V+ provides 5 W of power
- IEEE 802.3at Type 1 Class 0 compliant PoE
- 3.3 V output with up to 6 W of power (taken from V+)
- Support for applying external power to V+, in case PoE is unavailable
- Support for powering via the wESP32-Prog USB port (limited to 5 V on V+)
- Compatible with both PoE Mode A (power over data pairs) and PoE Mode B (power over spare pairs)
- Connectivity
- High-performance RJ-45 jack with optimized data path has excellent data throughput
- Ethernet auto-MDIX, allowing the use of both straight and cross-over Ethernet cables
- Wi-Fi 802.11 b/g/n is available as a back-up if Ethernet connectivity is unavailable
- Bluetooth v4.2 BR/EDR and BLE
- Programming
- Optional wESP32-Prog module for programming
- USB serial console via same wESP32-Prog module
- Expansion
- 20-pin header footprint with 3.3 V, V+ power, and 15 of the ESP32 GPIOs available for your application
- wESP32-Prog module can be plugged in as needed or permanently soldered
- Physical Characteristics
- Full data and power path isolation in compliance with the IEEE 802.3at 1500 Vrms isolation requirement
- Compact 75 mm by 40 mm footprint with 4 mounting holes compatible with common M2.5 or 4-40 screws
- High quality dual layer PCB with 2 oz copper for revisions prior to 7, 4-layer PCB with 1 oz copper from revision 7 onward and mounting hole designed to sink heat away from the PoE PD controller for optimal thermal performance