Hardware¶
This section provides basic info on the wESP32™ hardware. For more details, please refer to the wESP32 Product Brief.
GPIO header pinout¶
| Pin | Signal | SPI | UART | I2C | SDCARD | ANALOG | CAN |
|---|---|---|---|---|---|---|---|
| 1 | GND | ||||||
| 2 | 3.3V | ||||||
| 3 | IO23 | VSPI-MOSI | |||||
| 4 | IO36 | A0 | |||||
| 5 | IO39 | UART2-RX | A3 | ||||
| 6 | IO34 | A6 | |||||
| 7 | IO32 | VSPI-MISO | A4 / TCH9 | ||||
| 8 | IO35 | A7 | CAN-RX | ||||
| 9 | GND | ||||||
| 10 | IO33 | UART2-TX | I2C1-SDA | A5 / TCH8 | |||
| 11 | IO18 | VSPI-SCK | |||||
| 12 | IO5 | VSPI-SS | I2C1-SCL | CAN-TX | |||
| 13 | IO13 | HSPI-MOSI | UART1-TX | SD-DAT3 | |||
| 14 | IO14 | HSPI-SCK | SD-CLK | ||||
| 15 | IO4 | I2C0-SCL | SD-DAT1 | TCH0 | |||
| 16 | IO12 | HSPI-MISO | UART1-RX | SD-DAT2 | |||
| 17 | IO15 | HSPI-SS | SD-CMD | ||||
| 18 | IO2 | I2C0-SDA | SD-DAT0 | TCH2 | |||
| 19 | GND | ||||||
| 20 | V+ |
Pin 1 is by the mounting hole that is not plated.
Programming port pinout¶
| Pin | Name |
|---|---|
| 1 | IO0 (DTR of programmer) |
| 2 | EN (RTS of programmer) |
| 3 | GND |
| 4 | TXD (RXD of programmer) |
| 5 | RXD (TXD of programmer) |
| 6 | V+ |
Pin 1 is toward the middle of the board, pin 6 near the edge of the board.
Heat sink mounting hole¶
The plated mounting hole by the Ethernet jack can be used to sink heat away from the PD controller when using high output power. Please note that this hole is electrically connected to the PSE and not locally isolated, so it should not be connected to any metal that can be touched by the user.
5V solder jumper¶
By default the wESP32 V+ voltage is 12 V. When this is selected, 13 W of power is available. If you bridge the "5V" solder jumper, the V+ voltage is 5 V with a reduced power of 5 W.
HG solder jumper¶
By bridging the "HG" solder jumper, the plated mounting hole can be used to connect the isolated circuit ground to local ground. This should not be electrically connected to the plated mounting hole by the Ethernet jack as this would negate the isolation.